Bhalisela kwiMedia yethu yeNtlalo ukuze ufumane iPosi ngokukhawuleza
Intshayelelo yeLaser Processing kwi-Manufacturing
Itekhnoloji yokusetyenzwa kweLaser ifumene uphuhliso olukhawulezayo kwaye isetyenziswa kakhulu kwiinkalo ezahlukeneyo, ezifana ne-aerospace, i-automotive, i-electronics, kunye nokunye. Idlala indima ebalulekileyo ekuphuculeni umgangatho wemveliso, imveliso yabasebenzi, kunye ne-automation, ngelixa ukunciphisa ukungcola kunye nokusetyenziswa kwezinto eziphathekayo (Gong, 2012).
I-Laser Processing kwi-Metal kunye ne-Non-metal Materials
Esona sicelo siphambili sokusetyenzwa kwelaser kule minyaka ilishumi idlulileyo ibikwimathiriyeli yentsimbi, kubandakanya ukusika, ukuwelda, kunye nokugquma. Nangona kunjalo, intsimi iyanda ibe yizinto ezingezizo ezentsimbi ezifana nelaphu, iglasi, iiplastiki, iipolymers, kunye neekeramics. Nganye kwezi zixhobo zivula amathuba kumashishini ahlukeneyo, nangona sele sele eseke iindlela zokucubungula (Yumoto et al., 2017).
Imingeni kunye nezinto ezintsha kwi-Laser Processing yeGlasi
Iglasi, kunye nokusetyenziswa kwayo okubanzi kumashishini afana neemoto, ulwakhiwo, kunye nombane, imele indawo ebalulekileyo yokulungiswa kwelaser. Iindlela zokusika zeglasi eziqhelekileyo, ezibandakanya i-alloy eqinile okanye izixhobo zedayimane, zikhawulelwe ngokusebenza okuphantsi kunye nemiphetho erhabaxa. Ngokwahlukileyo, ukusika kwe-laser kunika enye indlela esebenzayo kunye nechanekileyo. Oku kubonakala ngakumbi kumashishini afana nokuveliswa kwe-smartphone, apho ukusika kwe-laser kusetyenziselwa ukugubungela iilensi zekhamera kunye nezikrini ezinkulu zokubonisa (Ding et al., 2019).
Ukusetyenzwa kweLaser yeeNdidi zeglasi zexabiso eliphezulu
Iindidi ezahlukeneyo zeglasi, njengeglasi yokukhanya, iglasi yequartz, kunye neglasi yesafire, zibonakalisa imiceli mngeni ekhethekileyo ngenxa yobume bazo. Nangona kunjalo, ubuchule belaser obuphambili obunje nge-femtosecond laser etching yenze ukuba kube lula ukusetyenzwa kwezi zixhobo (Sun & Flores, 2010).
Impembelelo yeWavelength kwiiNkqubo zeTekhnoloji yeLaser
Ubude be-laser buchaphazela kakhulu inkqubo, ngakumbi kwizinto ezifana nentsimbi yolwakhiwo. I-Lasers ephuma kwi-ultraviolet, ebonakalayo, ekufutshane kunye neendawo ezikude ze-infrared ziye zahlalutywa ngenxa yoxinano lwamandla abalulekileyo okunyibilika kunye nokuphuma kwamanzi (Lazov, Angelov, & Teirumnieks, 2019).
Izicelo ezahlukeneyo eziSekwe kwiWavelengths
Ukhetho lwe-laser wavelength alunamkhethe kodwa luxhomekeke kakhulu kwiipropathi zemathiriyeli kunye nesiphumo esifunwayo. Umzekelo, iilaser ze-UV (ezinobude obufutshane obufutshane) zigqwesile kukrolo oluchanekileyo kunye ne-micromachining, njengoko zinokuvelisa iinkcukacha eziphucukileyo. Oku kubenza balungele i-semiconductor kunye ne-microelectronics industry. Ngokwahlukileyo koko, iilaser ze-infrared zisebenza ngakumbi ekusetyenzweni kwemathiriyeli engqindilili ngenxa yobuchule bazo bokungena obunzulu, zibenza bafanelekele usetyenziso olunzima lwemizi-mveliso. (Majumdar & Manna, 2013) . Ngokufanayo, iilaser eziluhlaza, ezisebenza ngokuqhelekileyo kwi-wavelength ye-532 nm, zifumana i-niche yazo kwizicelo ezifuna ukuchaneka okuphezulu kunye nefuthe elincinci le-thermal. Zisebenza ngakumbi kwi-microelectronics kwimisebenzi efana nepateni yesekethe, kwizicelo zonyango kwiinkqubo ezifana ne-photocoagulation, kunye nakwicandelo lamandla ahlaziyekayo ekwenzeni iiseli zelanga. Ubude obukhethekileyo belaser eluhlaza bukwabenza bafanelekele ukumakisha kunye nokukrola izinto ezahlukeneyo, kubandakanya iiplastiki kunye neentsimbi, apho umahluko ophezulu kunye nomonakalo omncinci womphezulu ufunwayo. Oku kulungelelaniswa kwe-laser eluhlaza kugxininisa ukubaluleka kokukhethwa kwe-wavelength kwi-teknoloji ye-laser, ukuqinisekisa iziphumo ezichanekileyo zezinto ezithile kunye nezicelo.
II-525nm i-laser eluhlazaluhlobo oluthile lwetekhnoloji yelaser ephawulwa ngokukhutshwa kokukhanya okuluhlaza okwahlukileyo kumgama wamaza we-nanometers angama-525. Iilaser eziluhlaza kolu lwavelength zifumana izicelo kwi-retinal photocoagulation, apho amandla abo aphezulu kunye nokuchaneka kuluncedo. Zikwanokuba luncedo ekusetyenzweni kwemathiriyeli, ngakumbi kwiindawo ezifuna ukusetyenzwa kwempembelelo yobushushu obuchanekileyo kunye nobuncinci.Uphuhliso lwelaser diode eluhlaza kwi-c-plane ye-GaN substrate ukuya kubude bamaza amade kuma-524–532 nm luphawula inkqubela phambili ebalulekileyo kubuchwepheshe belaser. Olu phuhliso lubalulekile kwizicelo ezifuna iimpawu ezithile zamaza obude
Wave Continuous kunye neMithombo Laser Modelocked
Amaza aqhubekayo (CW) kunye nemithombo ye-laser ye-quasi-CW emodeliweyo kubude bamaza ahlukeneyo afana ne-infrared (NIR) ekufutshane ne-infrared (NIR) kwi-1064 nm, eluhlaza kwi-532 nm, kunye ne-ultraviolet (UV) kwi-355 nm zithathelwa ingqalelo kwi-laser doping ekhethiweyo yeeseli zelanga zelanga. Ubude bamaza ahlukeneyo aneempembelelo zokuvelisa ukulungelelanisa kunye nokusebenza kakuhle (uPatel et al., 2011).
Excimer Lasers kuba Wide Band Gap Materials
Ii-lasers ze-Excimer, ezisebenza kwi-UV wavelength, zifanelekile ukusetyenzwa kwezixhobo ezibanzi-bandgap njengeglasi kunye ne-carbon fibre-reinforced polymer (CFRP), enikezela ukuchaneka okuphezulu kunye nefuthe elincinci le-thermal (Kobayashi et al., 2017).
Nd:IiLaser zeYAG zosetyenziso lwezoShishino
I-Laser ye-Nd: YAG, kunye nokuguquguquka kwazo ngokwemiqathango yokulungiswa kwamaza, zisetyenziswa kuluhlu olubanzi lwezicelo. Ukukwazi kwabo ukusebenza kuzo zombini i-1064 nm kunye ne-532 nm ivumela ukuguquguquka ekuqhubeni izinto ezahlukeneyo. Umzekelo, i-1064 nm wavelength ilungele ukukrolwa okunzulu kwiintsimbi, ngelixa i-532 nm wavelength ibonelela ngokukrolwa komphezulu okumgangatho ophezulu kwiiplastiki kunye neentsimbi ezigqunyiweyo. (Inyanga et al., 1999).
→IiMveliso eziNxulumeneyo:I-CW Diode-ipumped i-laser eqinile-yelizwe ene-1064nm ubude bobude
I-High Power Fiber Laser Welding
IiLaser ezinobude obusondele kwi-1000 nm, ezinomgangatho olungileyo we-beam kunye namandla aphezulu, zisetyenziswa kwi-keyhole laser welding yesinyithi. Ezi lasers ngokufanelekileyo zifunxa kwaye zinyibilike izinto, zivelisa i-welds ezikumgangatho ophezulu (Salminen, Piili, & Purtonen, 2010).
Ukudityaniswa kweLaser Processing kunye nezinye iiTekhnoloji
Ukudityaniswa kokusetyenzwa kwelaser kunye nobunye ubugcisa bokuvelisa, obufana nokugquma kunye nokusila, kukhokelele kwiinkqubo zokuvelisa ezisebenza kakuhle neziguquguqukayo. Oku kudityaniswa kunenzuzo ngokukhethekileyo kumashishini afana nesixhobo kunye nokuvelisa kunye nokulungiswa kweenjini (Nowotny et al., 2010).
Ukwenziwa kweLaser kwiiNdawo ezisakhulayo
Ukusetyenziswa kwethekhnoloji ye-laser kwandisa kwimimandla ekhulayo njenge-semiconductor, ukubonisa, kunye namashishini efilimu amancinci, anikezela amandla amatsha kunye nokuphucula izinto eziphathekayo, ukuchaneka kwemveliso, kunye nokusebenza kwesixhobo (Hwang et al., 2022).
Iindlela zexesha elizayo kwi-Laser Processing
Uphuhliso lwexesha elizayo kwitekhnoloji yokusetyenzwa kwelaser lugxile kubuchule bokwenza inoveli, ukuphucula iimpawu zemveliso, ubunjineli obudityanisiweyo amacandelo ezinto ezininzi kunye nokuphucula izibonelelo zoqoqosho kunye nenkqubo. Oku kubandakanya ukwenziwa kwe-laser ngokukhawuleza kwezakhiwo ezine-porosity elawulwayo, i-hybrid welding, kunye ne-laser profile cutting of metal sheets (Kukreja et al., 2013).
Itekhnoloji yokucubungula iLaser, kunye nezicelo zayo ezahlukeneyo kunye nezinto ezintsha eziqhubekayo, ibumba ikamva lemveliso kunye nokulungiswa kwezinto. Ukuguquguquka kwayo kunye nokuchaneka kwayo kuyenza ibe sisixhobo esiyimfuneko kumashishini ahlukeneyo, ukutyhala imida yeendlela zokwenziwa kwemveli.
Lazov, L., Angelov, N., & Teirumnieks, E. (2019). INDLELA YOQIKELELO LOKUQALA LOKUXINXANISANA KWAMANDLA OKUBALULEKILEYO KWINKQUBO ZOBUGCISA ILASER.IMEKO. ITEKNOLOJI. IZIXHOBO. Iinkqubo zeNkomfa yaMazwe ngaMazwe yezeNzululwazi kunye neyoMsebenzi. Ikhonkco
Patel, R., Wenham, S., Tjahjono, B., Hallam, B., Sugianto, A., & Bovatsek, J. (2011). I-Speed-Speed Fabrication of Laser Doping Selective Emitter Solar Cells Ukusebenzisa i-532nm Continuous Wave (CW) kunye neModelocked Quasi-CW Laser Sources.Ikhonkco
Kobayashi, M., Kakizaki, K., Oizumi, H., Mimura, T., Fujimoto, J., & Mizoguchi, H. (2017). DUV amandla aphezulu lasers processing for iglasi kunye CFRP.Ikhonkco
Inyanga, H., Yi, J., Rhee, Y., Cha, B., Lee, J., & Kim, K.-S. (1999). I-Intracavity frequency esebenzayo iphinda-phinda kabini ukusuka kwi-diffusive reflector-type diode side-pumped Nd:YAG laser usebenzisa icrystal ye-KTP.Ikhonkco
Salminen, A., Piili, H., & Purtonen, T. (2010). Iimpawu zamandla aphezulu we-fiber laser welding.Iinkqubo zeZiko leeNjineli zoomatshini, iCandelo C: Ijenali yeNzululwazi yobuNjineli boMatshini, 224, 1019-1029.Ikhonkco
Majumdar, J., & Manna, I. (2013). Intshayelelo yokuNcedisa iLaser yokuFakwa kweMathiriyeli.Ikhonkco
Gong, S. (2012). Uphando kunye nokusetyenziswa kobuchwephesha bokuqhubekela phambili kwelaser.Ikhonkco
Yumoto, J., Torizuka, K., & Kuroda, R. (2017). Ukuphuhliswa kwebhedi yoVavanyo lweLaser-Manufacturing kunye neDatabase yeLaser-Material Processing.Uphononongo lobunjineli beLaser, 45, 565-570.Ikhonkco
Ding, Y., Xue, Y., Pang, J., Yang, L.-j., & Hong, M. (2019). Ukuqhubela phambili kwitekhnoloji yokuhlola i-in-situ yokusetyenzwa kwe-laser.I-SCENTIA SINICA Physica, Mechanica & Astronomica. Ikhonkco
ILanga, H., & Flores, K. (2010). Uhlalutyo lweMicrostructural ye-Laser-Processed Zr-Based Bulk Metallic Glass.IiNtengiselwano zeMetallurgical kunye neMathiriyeli A. Ikhonkco
Nowotny, S., Muenster, R., Scharek, S., & Beyer, E. (2010). Iseli ye-laser edibeneyo yokudibanisa i-laser kunye nokugaya.INdibano ezenzekelayo, i-30(1), 36-38.Ikhonkco
Kukreja, LM, Kaul, R., Paul, C., Ganesh, P., & Rao, BT (2013). IiNdlela zokuSebenza zeLaser ezisakhulayo zokuSebenza kuShishino lwexesha elizayo.Ikhonkco
Hwang, E., Choi, J., & Hong, S. (2022). Iinkqubo ezikhulayo ze-laser-assisted vacuum ze-ultra-precision, ukuveliswa kwemveliso ephezulu.Nanoscale. Ikhonkco
Ixesha lokuposa: Jan-18-2024