| Encapsulation Solder ye Iimfumba zeDiode Laser Bar | I-AuSn ipakishwe |
| Ubude beWaveleng esembindini | 1064nm |
| Amandla emveliso | ≥55W |
| Ukusebenza Ngoku | ≤30 A |
| I-Voltage esebenzayo | ≤24V |
| Imo yokusebenza | CW |
| Ubude beCavity | 900mm |
| Isibuko semveliso | T = 20% |
| Ubushushu baManzi | 25±3℃ |
Bhalisela kwiMedia yethu yeNtlalo ukuze ufumane iPosi ngokukhawuleza
Abstract
Imfuno ye-CW (i-Continuous Wave) iimodyuli ze-laser diode-pumped laser zikhula ngokukhawuleza njengomthombo obalulekileyo wokupompa kwii-laser-state lasers. Ezi modyuli zibonelela ngeenzuzo ezizodwa ukuhlangabezana neemfuno ezithile ze-solid-state laser applications. I-G2 - I-Diode Pump Solid State Laser, imveliso entsha ye-CW Diode Pump Series evela kwi-LumiSpot Tech, inomsebenzi obanzi wesicelo kunye nobuchule obungcono bokusebenza.
Kweli nqaku, siya kubandakanya umxholo ogxile kwizicelo zemveliso, iimpawu zemveliso, kunye nezibonelelo zemveliso malunga ne-CW diode pump solid-state laser. Ekupheleni kwenqaku, ndiza kubonisa ingxelo yovavanyo yeCW DPL evela kwiLumispot Tech kunye nezibonelelo zethu ezikhethekileyo.
Ummandla weSicelo
I-laser ye-semiconductor yamandla aphezulu isetyenziswa ikakhulu njengemithombo yempompo yeelaser zombuso oqinileyo. Kwizicelo ezisebenzayo, umthombo we-semiconductor laser diode-pumping ungundoqo wokuphucula i-laser diode-pumped solid-state laser technology.
Olu hlobo lwe-laser lusebenzisa i-laser ye-semiconductor ene-fixed wavelength output endaweni ye-Krypton yendabuko okanye i-Xenon Lamp ukumpompa iikristale. Ngenxa yoko, le laser ephuculweyo ibizwa ngokuba yi-2ndukuveliswa kwe-CW ye-laser yepompo (i-G2-A), eneempawu zokusebenza okuphezulu, ubomi benkonzo ende, umgangatho omhle we-beam, uzinzo oluhle, ukudibanisa kunye ne-miniaturization.
Amandla okuPhunxa amandla aphezulu
I-CW Diode Pump Source ibonelela ngokugqabhuka okukhulu komyinge wamandla okukhanya, ukumpompa ngokufanelekileyo indawo yokuzuza kwi-laser yelizwe elomeleleyo, ukuqaphela ukusebenza kakuhle kwelaser yelizwe eliqinileyo. Kwakhona, amandla ayo aphezulu kakhulu (okanye amandla aphakathi) enza uluhlu olubanzi lwezicelo kwiishishini, amayeza, kunye nenzululwazi.
I-Beam egqwesileyo kunye nokuzinza
Imodyuli ye-CW semiconductor yokumpompa imodyuli yelaser inomgangatho obalaseleyo wesibane sokukhanya, kunye nozinzo ngokuzenzekelayo, okubalulekileyo ukuqaphela ukuphuma kokukhanya kwelaser okulawulwayo. Iimodyuli zenzelwe ukuvelisa iphrofayili ye-boam echazwe kakuhle kwaye izinzile, iqinisekisa ukupompa okuthembekileyo kunye nokuqhubekayo kwe-laser-state eqinile. Eli nqaku lihlangabezana ngokugqibeleleyo neemfuno zesicelo se-laser kwi-processing material process, ukusika laser, kunye neR&D.
Ukusebenza ngokuqhubekayo kwamaza
Imowudi yokusebenza yeCW idibanisa zombini iimfanelo ze-laser ye-wavelength eqhubekayo kunye nePulsed Laser. Umahluko omkhulu phakathi kweCW Laser kunye nePulsed laser kukukhutshwa kwamandla.CW i-laser, eyaziwa ngokuba yi-laser wave eqhubekayo, ineempawu zemowudi yokusebenza ezinzileyo kunye nokukwazi ukuthumela i-wave eqhubekayo.
Uyilo oluQhelekileyo noluthembekileyo
I-CW DPL inokudityaniswa lula ngokui-laser yelizwe eliqinileyokuxhomekeke kuyilo oludibeneyo kunye nesakhiwo. Ukwakhiwa kwabo okuqinileyo kunye namacandelo aphezulu aqinisekisa ukuthembeka kwexesha elide, ukunciphisa iindleko zokunciphisa kunye nokugcinwa kweendleko, okubaluleke kakhulu kwimveliso yezoshishino kunye neenkqubo zonyango.
Imfuno yeMarike yoLuhlu lwe-DPL-Amathuba akhulayo eMarike
Njengoko imfuno ye-laser-state lasers iqhubeka nokukhula kuwo wonke amashishini ahlukeneyo, kunjalo nesidingo semithombo yokumpompa esebenza ngokuphezulu efana ne-CW diode-pumped laser modules. Amashishini afana nemveliso, ezempilo, ukhuselo, kunye nophando lwezenzululwazi luxhomekeke kwii-laser zombuso oqinileyo ukulungiselela izicelo ezichanekileyo.
Ukushwankathela, njengomthombo wokumpompa we-diode ye-laser-state eqinile, iimpawu zeemveliso: amandla okumpompa amandla aphezulu, imowudi yokusebenza kweCW, umgangatho ogqwesileyo we-beam kunye nozinzo, kunye noyilo olucwangcisiweyo, yonyusa imfuno yentengiso kwezi. iimodyuli ze-laser. Njengomthengisi, iLumispot Tech ikwabeka umzamo omkhulu wokuphucula ukusebenza kunye nobuchwepheshe obusetyenziswa kuthotho lweDPL.
Iseti yeMveliso yeMveliso ye-G2-A DPL evela kwiLumispot Tech
Iseti nganye yeemveliso iqulethe amaqela amathathu eemodyuli ezipakishwe ngokuthe tye, iqela ngalinye leemodyuli ze-Horizontal Stacked Array ukumpompa amandla amalunga ne-100W@25A, kunye namandla okumpompa ewonke 300W@25A.
Indawo yempompo ye-G2-A ye-fluorescence iboniswe ngezantsi:
IDatha yobuGcisa ePhambili ye-G2-A Diode Pump Solid State Laser :
Amandla ethu kubuchwephesha
1. ITekhnoloji yoLawulo lweThermal edlulayo
I-semiconductor-pumped solid-state lasers zisetyenziswa ngokubanzi kwi-quasi-continuous wave application (CW) enencopho ephezulu yokuphuma kwamandla kunye nosetyenziso lwamaza okuqhubayo (CW) olunomlinganiselo ophezulu wokuphuma kwamandla. Kwezi lasers, ukuphakama kwe-thermal sink kunye nomgama phakathi kweetshiphusi (oko kukuthi, ubukhulu be-substrate kunye ne-chip) kunempembelelo enkulu kwisakhono sokutshatyalaliswa kobushushu bemveliso. Umgama omkhulu we-chip-to-chip ukhokelela ekulahlekeni kobushushu obungcono kodwa wonyusa umthamo wemveliso. Ngakolunye uhlangothi, ukuba isithuba se-chip sincitshisiwe, ubungakanani bemveliso buya kuncitshiswa, kodwa amandla okutshatyalaliswa kobushushu bemveliso anganelanga. Ukusebenzisa owona mthamo uxineneyo ukuyila eyona semiconductor-pumped solid-state laser ehlangabezana neemfuno zokuchitha ubushushu ngumsebenzi onzima kuyilo.
Igrafu ye-Stady-state Thermal Simulation
ILumispot Tech isebenzisa indlela yesiqalelo esinesiphelo ukulinganisa nokubala indawo yobushushu besixhobo. Indibaniselwano yokuhanjiswa kobushushu obuqinileyo kwisimo sokulinganisa sobushushu kunye nokulinganisa ubushushu bolwelo kusetyenziselwa ukulinganisa i-thermal. Kwiimeko zokusebenza eziqhubekayo, njengoko kubonisiwe kumzobo ongezantsi: imveliso indululwa ukuba ibe nesithuba se-chip esilungileyo kunye nolungiselelo phantsi kokudluliselwa kobushushu obuqinileyo kwiimeko ezizinzileyo zokulinganisa i-thermal. Ngaphantsi kwesi sikhewu kunye nolwakhiwo, imveliso inamandla okuphelisa ubushushu, iqondo lobushushu eliphantsi, kunye neyona mpawu ixineneyo.
2.AuSn solderinkqubo encapsulation
I-Lumispot Tech isebenzisa ubuchule bokupakisha obusebenzisa i-solder ye-AnSn endaweni ye-solder ye-indium yendabuko ukujongana nemiba enxulumene nokudinwa kwe-thermal, i-electromigration, kunye nokufuduka kombane-thermal okubangelwa yi-indium solder. Ngokwamkela i-AuSn solder, inkampani yethu ijolise ekuphuculeni ukuthembeka kwemveliso kunye nokuphila ixesha elide. Olu tshintsho lwenziwa lo gama kuqinisekiswa izithuba ezithe gqolo zezipaki zebha, zinegalelo elingaphaya kuphuculo lokuthembeka kwemveliso nobomi.
Kwitekhnoloji yokupakisha ye-high-power semiconductor pumped solid-state laser, i-indium (In) yentsimbi yamkelwe njengesixhobo sokuwelda ngabavelisi bezizwe ngezizwe ngenxa yeenzuzo zayo kwindawo ephantsi yokunyibilika, uxinzelelo oluphantsi lwe-welding, ukusebenza lula, kunye neplastiki elungileyo. deformation kunye nokungena. Nangona kunjalo, kwi-semiconductor epompa i-laser yombuso oqinileyo phantsi kweemeko zesicelo esiqhubekayo, uxinzelelo olutshintshanayo luya kubangela ukudinwa komgangatho we-indium welding, okuya kukhokelela ekungaphumeleli kwemveliso. Ngokukodwa kumaqondo okushisa aphezulu kunye aphantsi kunye nobubanzi be-pulse ende, izinga lokungaphumeleli kwe-indium welding licacile kakhulu.
Ukuthelekisa iimvavanyo zobomi ezikhawulezayo zeelaser ezineephakheji ezahlukeneyo zesolder
Emva kweeyure ze-600 zokuguga, zonke iimveliso ezifakwe kwi-indium solder ziyasilela; ngelixa iimveliso ezifakwe ngetoti yegolide zisebenza ngaphezu kweeyure ezingama-2,000 phantse akukho tshintsho kumandla; ebonisa izinto ezilungileyo ze-AuSn encapsulation.
Ukuze kuphuculwe ukuthembeka kwe-laser ye-semiconductor yamandla aphezulu ngelixa ugcina ukuhambelana kwezibonakaliso ezahlukeneyo zokusebenza, i-Lumispot Tech ithatha i-Hard Solder (AuSn) njengohlobo olutsha lwezinto zokupakisha. Ukusetyenziswa kwe-coefficient yokwandiswa kwe-thermal ehambelana ne-substrate impahla (i-CTE-Matched Submount), ukukhululwa okusebenzayo koxinzelelo lwe-thermal, isisombululo esihle kwiingxaki zobuchwepheshe ezinokuhlangabezana nazo ekulungiseleleni i-solder enzima. Imeko efunekayo kwi-substrate material (submount) ukuze ikwazi ukuthengiswa kwi-chip ye-semiconductor yi-metalization yomhlaba. I-metalization ye-Surface kukwenziwa koluhlu lwesithintelo sokusasazwa kunye ne-solder infiltration layer kumphezulu we-substrate material.
Umzobo weSchematic wendlela ye-electromigration ye-laser efakwe kwi-indium solder
Ukuze kuphuculwe ukuthembeka kwe-laser ye-semiconductor yamandla aphezulu ngelixa ugcina ukuhambelana kwezibonakaliso ezahlukeneyo zokusebenza, i-Lumispot Tech ithatha i-Hard Solder (AuSn) njengohlobo olutsha lwezinto zokupakisha. Ukusetyenziswa kwe-coefficient yokwandiswa kwe-thermal ehambelana ne-substrate impahla (i-CTE-Matched Submount), ukukhululwa okusebenzayo koxinzelelo lwe-thermal, isisombululo esihle kwiingxaki zobuchwepheshe ezinokuhlangabezana nazo ekulungiseleleni i-solder enzima. Imeko efunekayo kwi-substrate material (submount) ukuze ikwazi ukuthengiswa kwi-chip ye-semiconductor yi-metalization yomhlaba. I-metalization ye-Surface kukwenziwa koluhlu lwesithintelo sokusasazwa kunye ne-solder infiltration layer kumphezulu we-substrate material.
Injongo yayo kwelinye icala ukuthintela i-solder kwi-substrate material diffusion, kwelinye icala kukuqinisa i-solder kunye ne-substrate ye-welding ye-welding, ukukhusela i-solder layer of the cavity. I-metallization engaphezulu inokuthintela i-substrate ye-oxidation yomhlaba kunye nokungena komswakama, ukunciphisa ukunyanzeliswa koqhagamshelwano kwinkqubo ye-welding, kwaye ngaloo ndlela iphucula amandla e-welding kunye nokuthembeka kwemveliso. Ukusetyenziswa kwe-solder eqinile i-AuSn njengesixhobo sokuwelda i-semiconductor pumped solid state lasers inokuphepha ngokufanelekileyo ukudinwa kwe-indium, i-oxidation kunye nokufuduka kwe-electro-thermal kunye nezinye iziphene, ukuphucula kakhulu ukuthembeka kwe-lasemiconductor lasers kunye nobomi benkonzo ye-laser. Ukusetyenziswa kweteknoloji ye-gold-tin encapsulation inokoyisa iingxaki ze-electromigration kunye ne-electrothermal migration ye-indium solder.
Isisombululo esivela kwiLumispot Tech
Kwii-lasers eziqhubekayo okanye ezityhalwayo, ubushushu obuveliswa kukufunxwa kwempompo yemitha nge-laser medium kunye nokupholisa kwangaphandle okuphakathi kukhokelela ekuhanjisweni kobushushu obungalinganiyo ngaphakathi kwendawo ye-laser, okukhokelela kwi-gradients yobushushu, ebangela utshintsho kwisalathiso se-refractive se-medium. kwaye emva koko ivelise iziphumo ezahlukeneyo ze-thermal. Ukufakwa kwe-thermal ngaphakathi kwendawo yokuzuza kukhokelela kwisiphumo se-lensing ye-thermal kunye ne-thermal-induced birefringence effect, evelisa ilahleko ethile kwinkqubo ye-laser, echaphazela ukuzinza kwe-laser kwi-cavity kunye nomgangatho we-beam yokuphuma. Kwinkqubo ye-laser eqhubekayo, uxinzelelo lwe-thermal ekufumaneni okuphakathi lutshintsha njengoko amandla epompo enyuka. Iziphumo ezahlukeneyo zobushushu kwinkqubo zichaphazela kakhulu inkqubo ye-laser ukufumana umgangatho ongcono we-beam kunye namandla aphezulu aphumayo, enye yeengxaki ekufuneka zisonjululwe. Indlela yokuthintela ngokufanelekileyo kunye nokunciphisa umphumo we-thermal we-crystals kwinkqubo yokusebenza, izazinzulu ziye zakhathazeka ixesha elide, ziye zaba enye yeendawo zophando zangoku.
Nd:I-laser ye-YAG ene-thermal lens cavity
Kwiprojekthi yokuphuhlisa amandla aphezulu e-LD-pumped Nd: YAG lasers, i-Nd: YAG lasers ene-thermal lensing cavity yasonjululwa, ukuze imodyuli ikwazi ukufumana amandla aphezulu ngelixa ifumana umgangatho ophezulu we-beam.
Kwiprojekthi yokuphuhlisa amandla aphezulu e-LD-pumped Nd: LAG laser, iLumispot Tech iye yaphuhlisa imodyuli ye-G2-A, eyisombulula kakhulu ingxaki yamandla aphantsi ngenxa ye-lens-containing cavities, evumela ukuba imodyuli ifumane amandla aphezulu. ngomgangatho ophezulu we-beam.
Ixesha lokuposa: Jul-24-2023