Izinto zeSolder kwiiBar zeDiode zeLaser: Ibhulorho eBalulekileyo phakathi kokuSebenza kunye nokuthembeka

Kuyilo kunye nokuveliswa kwe-laser ye-semiconductor ephezulu yamandla, imivalo ye-laser diode isebenza njengeeyunithi ezingundoqo ezikhupha ukukhanya. Ukusebenza kwabo akuxhomekanga kuphela kumgangatho wangaphakathi we-laser chips kodwa kakhulu kwinkqubo yokupakisha. Phakathi kwamacandelo ahlukeneyo abandakanyekayo ekupakisheni, izixhobo ze-solder zidlala indima ebalulekileyo njenge-interface ye-thermal kunye nombane phakathi kwe-chip kunye ne-heat sink.

1. Indima yeSolder kwiiBar zeDiode zeLaser

Iibha ze-laser diode zihlala zidibanisa ii-emitters ezininzi, ezikhokelela ekuxinaneni kwamandla aphezulu kunye neemfuno ezingqongqo zolawulo lobushushu. Ukufezekisa ukutshatyalaliswa kobushushu obusebenzayo kunye nokuzinza kwesakhiwo, izixhobo ze-solder kufuneka zihlangabezane nale migaqo ilandelayo:

① Ukuhanjiswa kwe-thermal ephezulu:

Iqinisekisa ukuhanjiswa kobushushu okusebenzayo kwi-laser chip.

② Ukumanzisa okulungileyo:

Inika ukudibanisa okuqinileyo phakathi kwe-chip kunye ne-substrate.

③ Indawo efanelekileyo yokunyibilika:

Ikhusela ukuvela kwakhona okanye ukuthotywa ngexesha lokuqhubekeka okanye ukusebenza okulandelayo.

④ I-coefficient ehambelanayo yokwandiswa kwe-thermal (CTE):

Inciphisa uxinzelelo lwe-thermal kwi-chip.

⑤ Ukumelana nokudinwa okugqwesileyo:

Yandisa ubomi benkonzo yesixhobo.

2. Iintlobo eziqhelekileyo zeSolder kwi-Laser Bar Packaging

Ezi zilandelayo zezona ntlobo zintathu ziphambili zemathiriyeli ye-solder edla ngokusetyenziswa ukupakishwa kwee-laser diode bar:

①Ingxubevange yeTin yeGolide (AuSn)

Iinkcazelo ngeempawu:

Ukuqulunqwa kwe-Eutectic ye-80Au/20Sn enendawo yokunyibilika ye-280 ° C; high conductivity thermal kunye namandla omatshini.

Izinto eziluncedo:

Uzinzo olugqwesileyo lobushushu obuphezulu, ubomi obude bokudinwa kwe-thermal, simahla kungcoliseko lwendalo, ukuthembeka okuphezulu

Usetyenziso:

Umkhosi, i-aerospace, kunye neenkqubo eziphezulu ze-laser zoshishino.

②I-Indium enyulu (Ngaphakathi)

Iinkcazelo ngeempawu:

Indawo yokunyibilika ye-157 ° C; ithambile kwaye ithambile kakhulu.

Izinto eziluncedo:

Ukusebenza okuphezulu kwebhayisikile eshushu, uxinzelelo oluphantsi kwitshiphu, ilungele ukukhusela izakhiwo ezibuthathaka, ezilungele iimfuno zobushushu obuphantsi.

Imida:

Ithambekele kwi-oxidation; idinga umoya ongasebenziyo ngexesha lokucubungula, amandla aphantsi omatshini; ayilunganga kwizicelo ezinomthwalo ophezulu

③IiNkqubo zeSolder ezidityanisiweyo (umzekelo, iAuSn + ngaphakathi)

Ulwakhiwo:

Ngokwesiqhelo, i-AuSn isetyenziswa phantsi kwetshiphu kuncamatheliso olomeleleyo, ngelixa i-In ifakwa ngaphezulu ukwenzela ukuphuculwa kwe-thermal buffering.

Izinto eziluncedo:

Idibanisa ukuthembeka okuphezulu kunye nokukhululeka koxinzelelo, iphucula ukuqina kokupakisha, ilungelelanisa kakuhle kwiindawo ezahlukeneyo zokusebenza.

3. Impembelelo yoMgangatho weSolder kwiNdlela yokuSebenza kweDiva

Ukukhethwa kwezinto ze-Solder kunye nolawulo lwenkqubo kuchaphazela kakhulu ukusebenza kwe-electro-optical kunye nokuzinza kwexesha elide lezixhobo ze-laser:

Ngaphantsi kokusebenza ngokuqhubekayo kwamandla aphezulu, kwaneziphene ezincinci kwi-soldering zingakhokelela ekwakhiweni kwe-thermal, kubangele ukuthotywa kokusebenza okanye ukusilela kwesixhobo. Ke ngoko, ukukhetha i-solder ekumgangatho ophezulu kunye nokuphumeza iinkqubo ezichanekileyo zokuthengisa zibalulekile ekufezekiseni ukuthembeka okuphezulu kwe-laser ukupakishwa.

4. IiNdlela zekamva kunye noPhuhliso

Njengoko itekhnoloji ye-laser iqhubeka nokungena kushishino, utyando lwezonyango, i-LiDAR, kunye namanye amacandelo, izixhobo ze-solder zokupakishwa kwe-laser zivela ngale ndlela ilandelayo:

①I-soldering yobushushu obuphantsi:

Ukuze kudityaniswe nezinto ezibuthathaka ze-thermal

②Isoda engenalothi:

Ukuhlangabezana ne-RoHS kunye neminye imimiselo yokusingqongileyo

③Izixhobo zojongano oluphezulu lwe-thermal (TIM):

Ukunciphisa ngakumbi ukuxhathisa kwe-thermal

④Itekhnoloji ye-Micro-soldering:

Ukuxhasa i-miniaturization kunye nokudibanisa okuphezulu

5. Isiphelo

Nangona i-volume encinci, izixhobo ze-solder ziziqhagamshelo ezibalulekileyo eziqinisekisa ukusebenza kunye nokuthembeka kwezixhobo ze-laser zamandla aphezulu. Ekupakishweni kwemivalo ye-laser diode, ukukhetha i-solder efanelekileyo kunye nokuphucula inkqubo yokubambisana kubalulekile ekufezekiseni umsebenzi ozinzileyo wexesha elide.

6. Malunga Nathi

I-Lumispot izibophelele ekuboneleleni abathengi ngezixhobo zelaser ezinobungcali nezithembekileyo kunye nezisombululo zokupakisha. Ngamava abanzi ekukhetheni izinto ze-solder, uyilo lolawulo lwe-thermal, kunye nokuvavanya ukuthembeka, sikholelwa ukuba konke ukucocwa ngokweenkcukacha kuvula indlela yokugqwesa. Ngolwazi oluthe kratya malunga netekhnoloji yokupakisha ye-laser yamandla aphezulu, zive ukhululekile ukuqhagamshelana nathi.