Umgaqo wokususwa kweenwele laser
Ukususwa kweenwele zeLaser kusekelwe kwithiyori yesenzo esikhethiweyo sefotothermal.I-follicle yeenwele kunye ne-hair shaft zizityebi kwi-melanin kwaye i-laser inokujolisa i-melanin yonyango lokususwa kweenwele ngokuchanekileyo nangokukhethiweyo.Emva kokuba i-melanin ithathe amandla e-laser, ukushisa kuphakama ngokukhawuleza, okukhokelela ekubhujisweni kwezicubu zeenwele ezijikelezayo kunye nokususa iinwele.
Ngophuhliso lwetekhnoloji ye-laser ye-semiconductor, iimveliso ezisebenzisa i-VCSEL njengesixhobo esiphambili zibonisa iingenelo ezininzi, kwaye ziye zaphumelela ngakumbi ukuqatshelwa kunye nokuthandwa ngabathengi behlabathi kwicandelo lobuhle belaser.Okwangoku, isixhobo esiqhelekileyo sokususa iinwele kwintengiso sisebenzisa i-808nm laser njengesona sixhobo siphambili.
Okwangoku, imfuno yentengiso ye-semiconductor laser chip yomelele, ngoko kubaluleke kakhulu ukwenza uphando oluzimeleyo kwi-semiconductor laser chip.Uluhlu lwestakhi esithe nkqo se-LUMISPOT ububanzi bepulse ububanziisebenzisa itekhnoloji yoxinaniso lwebha yoxinaniso oluphezulu ukubonelela ngeepakethi ezininzi ze-laser bar ezithe nkqo ngobubanzi be-millisecond.Imodyuli ithatha idizayini yokutshatyalaliswa kobushushu obuphezulu, isakhiwo sokupholisa amanzi se-macro channel (ngaphandle kwamanzi adibeneyo), ukwenzela ukuba imodyuli ikwazi ukufezekisa ukukhutshwa kwe-laser ephezulu ngelixa igcina ubungakanani obuncinci.