Bhalisela kwiMidiya yethu yeNtlalo ukuze ufumane iPosi ekhawulezileyo
Intshayelelo
Ngenxa yokuqhubela phambili ngokukhawuleza kwithiyori yelaser ye-semiconductor, izixhobo, iinkqubo zokuvelisa, kunye nobuchwepheshe bokupakisha, kunye nokuphuculwa okuqhubekayo kwamandla, ukusebenza kakuhle, kunye nobomi, iilaser ze-semiconductor ezinamandla aphezulu zisetyenziswa ngakumbi njengemithombo yokukhanya ethe ngqo okanye yokupompa. Ezi laser azisetyenziswa kuphela ngokubanzi ekucutshungulweni kwelaser, unyango lwezonyango, kunye nobuchwepheshe bokubonisa kodwa zikwabalulekile kunxibelelwano lwe-optical yesithuba, ukuqonda umoya, i-LIDAR, kunye nokuqondwa kwethagethi. Iilaser ze-semiconductor ezinamandla aphezulu zibaluleke kakhulu kuphuhliso lwamashishini amaninzi obuchwephesha obuphezulu kwaye zimele indawo yokhuphiswano olucwangcisiweyo phakathi kwamazwe aphuhlileyo.
I-Multi-Peak Semiconductor Stacked Array Laser ene-Fast-Axis Collimation
Njengemithombo ephambili yepompo ye-solid-state kunye ne-fiber lasers, ii-semiconductor lasers zibonisa utshintsho lwe-wavelength ukuya kwi-red spectrum njengoko amaqondo obushushu okusebenza enyuka, ngesiqhelo yi-0.2-0.3 nm/°C. Oku kushukuma kunokukhokelela ekungahambelani phakathi kwemigca yokukhupha ye-LDs kunye nemigca yokukhupha ye-solid gain media, kunciphisa i-absorption coefficient kwaye kunciphisa kakhulu ukusebenza kakuhle kwe-laser output. Ngokwesiqhelo, iinkqubo zokulawula ubushushu ezintsonkothileyo zisetyenziselwa ukupholisa ii-laser, ezonyusa ubungakanani benkqubo kunye nokusetyenziswa kwamandla. Ukuhlangabezana neemfuno ze-miniaturization kwizicelo ezifana nokuqhuba okuzenzakalelayo, i-laser ranging, kunye ne-LIDAR, inkampani yethu ingenise uthotho lwe-multi-peak, olupholileyo oluhlanganisiweyo oluhlanganisiweyo lwe-LM-8xx-Q4000-F-G20-P0.73-1. Ngokwandisa inani lemigca yokukhupha ye-LD, le mveliso igcina ukufunxwa okuzinzileyo yi-solid gain medium kuluhlu olubanzi lobushushu, inciphisa uxinzelelo kwiinkqubo zokulawula ubushushu kwaye inciphise ubungakanani kunye nokusetyenziswa kwamandla kwe-laser ngelixa iqinisekisa ukuphuma kwamandla aphezulu. Ukusebenzisa iinkqubo zovavanyo lwe-bare chip eziphucukileyo, i-vacuum coalescence bonding, i-interface material kunye ne-fusion engineering, kunye nolawulo lwe-transient thermal, inkampani yethu inokufikelela kulawulo oluchanekileyo lwe-multi-peak, ukusebenza kakuhle okuphezulu, ulawulo lwe-thermal oluphucukileyo, kunye nokuqinisekisa ukuthembeka kwexesha elide kunye nobomi bemveliso yethu ye-array.
Umfanekiso 1 Umzobo weMveliso we-LM-8xx-Q4000-F-G20-P0.73-1
Iimpawu zeMveliso
Ukukhupha i-Multi-Peak Emission eLawulwayo Njengomthombo wepompo ye-solid-state lasers, le mveliso intsha yenzelwe ukwandisa uluhlu lobushushu oluzinzileyo kunye nokwenza lula inkqubo yolawulo lobushushu lwe-laser phakathi kweendlela ezijolise kwi-semiconductor laser miniaturization. Ngenkqubo yethu yokuvavanya i-bare chip ephucukileyo, sinokukhetha ngokuchanekileyo ubude be-bar chip kunye namandla, sivumela ulawulo kuluhlu lwe-wavelength yemveliso, isithuba, kunye neencopho ezininzi ezilawulekayo (≥2 peaks), ezikhulisa uluhlu lobushushu olusebenzayo kwaye zizinzise ukufunxwa kwepompo.
Umfanekiso 2 LM-8xx-Q4000-F-G20-P0.73-1 I-Spectrogram yeMveliso
Uxinzelelo lwe-Fast-Axis
Le mveliso isebenzisa iilensi ze-micro-optical ukucinezela ngokukhawuleza, ilungelelanisa i-engile yokwahlukana kwe-axis ekhawulezayo ngokweemfuno ezithile ukuphucula umgangatho we-beam. Inkqubo yethu ye-collimation ekwi-intanethi ye-axis ekhawulezayo ivumela ukujonga nokulungisa ngexesha langempela ngexesha lenkqubo yokucinezela, ukuqinisekisa ukuba iprofayili yendawo iyaziqhelanisa kakuhle notshintsho lobushushu bendalo, ngotshintsho olungaphantsi kwe-12%.
Uyilo lweModular
Le mveliso idibanisa ukuchaneka nokusebenza kakuhle kuyilo lwayo. Iphawulwa yimbonakalo yayo encinci nelula, inika ukuguquguquka okuphezulu ekusebenziseni okusebenzayo. Isakhiwo sayo esomeleleyo, esihlala ixesha elide kunye nezinto ezinokuthembeka okuphezulu ziqinisekisa ukusebenza okuzinzileyo kwexesha elide. Uyilo lwemodyuli luvumela ukwenziwa ngokwezifiso okuguquguqukayo ukuhlangabezana neemfuno zabathengi, kubandakanya ukwenziwa ngokwezifiso kwamaza obude, isithuba sokukhupha umbane, kunye nokucinezelwa, okwenza imveliso ibe yeguquguqukayo kwaye ithembeke.
Itekhnoloji yoLawulo loBushushu
Kwimveliso ye-LM-8xx-Q4000-F-G20-P0.73-1, sisebenzisa izixhobo zokuqhuba ubushushu eziphezulu ezihambelana ne-CTE yebha, siqinisekisa ukuhambelana kwezinto kunye nokuchithwa kobushushu okugqwesileyo. Iindlela ze-Finite element zisetyenziswa ukulinganisa nokubala intsimi yobushushu yesixhobo, ukudibanisa ngempumelelo iisimulations zobushushu ezidlulayo nezizinzileyo ukulawula utshintsho lobushushu ngcono.
Umfanekiso 3 Ukulinganisa Ubushushu beMveliso ye-LM-8xx-Q4000-F-G20-P0.73-1
Ulawulo lweNkqubo Le modeli isebenzisa iteknoloji yendabuko yokuwelda i-hard solder. Ngokusebenzisa ulawulo lwenkqubo, iqinisekisa ukuchithwa kobushushu okufanelekileyo ngaphakathi kwesithuba esimiselweyo, kungekuphela nje ukugcina ukusebenza kwemveliso kodwa nokuqinisekisa ukhuseleko nokuhlala kwayo ixesha elide.
Iinkcukacha zeMveliso
Le mveliso ine-wavelengths ezilawulekayo ze-multi-peak, ubungakanani obuncinci, ubunzima obulula, ukusebenza kakuhle kokuguqulwa kwe-electro-optical, ukuthembeka okuphezulu, kunye nobomi obude. I-laser yethu yamva nje ye-multi-peak semiconductor stacked array bar laser, njenge-laser ye-multi-peak semiconductor, iqinisekisa ukuba incochoyi nganye ye-wavelength ibonakala ngokucacileyo. Ingenziwa ngokwezifiso ngokweemfuno ezithile zabathengi kwiimfuno ze-wavelength, isithuba, inani lee-bar, kunye namandla okukhupha, ibonisa iimpawu zayo zoqwalaselo oluguquguqukayo. Uyilo lwe-modular luhambelana noluhlu olubanzi lweendawo zesicelo, kwaye ukuhlanganiswa kweemodyuli ezahlukeneyo kunokuhlangabezana neemfuno zabathengi ezahlukeneyo.
| Inombolo yoMzekelo | LM-8xx-Q4000-F-G20-P0.73-1 | |
| Iinkcukacha zobugcisa | iyunithi | ixabiso |
| Indlela Yokusebenza | - | I-QCW |
| Isantya sokuSebenza | Hz | 20 |
| Ububanzi bePulse | us | 200 |
| Isithuba seBha | mm | 0. 73 |
| Amandla Aphezulu Ngebha nganye | W | 200 |
| Inani leeBhari | - | 20 |
| Ubude beWave Ephakathi (kwi-25°C) | nm | A:798±2;B:802±2;C:806±2;D:810±2;E:814±2; |
| I-Angle ye-Fast-Axis Divergence (FWHM) | ° | 2-5 (eqhelekileyo) |
| I-Angle ye-Slow-Axis Divergence (FWHM) | ° | 8 (eqhelekileyo) |
| Imo yokuHlanganisa | - | TE |
| I-Wavelength Temperature Coefficient | nm/°C | ≤0.28 |
| Ukusebenza kwangoku | A | ≤220 |
| Umda wangoku | A | ≤25 |
| I-Voltage/Ibha yokusebenza | V | ≤2 |
| Ukusebenza kakuhle kwethambeka/ibha | Ngaphandle/Ngaphantsi | ≥1.1 |
| Ukusebenza kakuhle kokuguqula | % | ≥55 |
| Ubushushu bokusebenza | °C | -45~70 |
| Ubushushu bokugcina | °C | -55~85 |
| Ubomi bonke (iifoto) | - | ≥109 |
Umzobo wobukhulu bembonakalo yemveliso:
Umzobo wobukhulu bembonakalo yemveliso:
Amaxabiso aqhelekileyo edatha yovavanyo aboniswe ngezantsi:
Ixesha leposi: Meyi-10-2024